Fundamentals of Spattering and Improvement Measures for Equipment - Improving Film Thickness Distribution from Troubleshooting
What are the methods for improving film thickness distribution, reducing particles, and enhancing step coverage required during the sputtering process?
Instructor To: Mr. [Name], Department Head, Semiconductor Electronics Technology Research Institute, ULVAC, Inc. Target Audience: Engineers, researchers, and beginners interested in sputtering and thin film technology. Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 2 [Tokyo, Nihonbashi] Access: 5 minutes from B4 exit via underground passage from Bakuroyokoyama Station on the Toei Shinjuku Line (Directions 2) 5 minutes from C1 exit via East Exit ticket gate from Bakurocho Station on the JR Sobu Rapid Line (Directions 3) and others. Date and Time: December 16, 2011 (Friday) 13:30-16:30 Capacity: 20 people. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 participants from one company. *Limited to Tech-Zone members who apply by December 2. Membership registration is free. *After December 2, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company.
